Structure equipped with electrical contacts formed through the substrate of this structure and process for obtaining such a structure
US6546623B2 · kind B2 · utility
4Cited by
109References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2002 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Mar 13, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process for manufacturing a structure equipped with at least one electrical contact, including forming on a substrate a first layer, forming on a front side of the first layer the structure equipped with at least one electrical contact, forming at least one hole though the substrate revealing a rear side of the first layer, and forming an electrical contact to the rear side in a cavity overhung by an edge of the at least one hole closest to the first layer, the edge allowing for electrical insulation of the electrical contact from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.