Method and apparatus for illuminating projecting features on the surface of a semiconductor wafer
US6547409B2 · kind B2 · utility
8Cited by
21References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2001 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Jul 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Plural light sources are provided for directing ring patterns of light toward at least one reflective bump formed on and projecting from a first wafer surface of a semiconductor wafer. The intensity of light from the light sources may be varied and may be varied independently of one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.