Semiconductor device and process of producing same
US6548326B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2001 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Dec 13, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a first electronic part and a second electronic part, the first electronic part being larger than the second electronic part in area and in the number of connection terminal pads including pad form electrode terminals, and external connection terminals or other connection terminals bonded to the connection terminal pads, wherein the first and second electronic parts are disposed one upon the other with respective pad forming surfaces facing each other and are electrically connected to each other by flip-chip bonding; and springy wire form connection terminals stand on, and are bonded to, the connection terminal pads of the first electronic part other than those electrically connected to the connection terminal pads of the second electronic part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.