Vapor chamber active heat sink
US6550531B1 · kind B1 · utility
53Cited by
13References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 2000 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | May 16, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation device including a base portion having a plurality of projections extending therefrom. The base portion may have a vapor chamber defined therein and may have first surface sloped from a central apex portion to edges of the base portion. The vapor chamber includes at least one extension on a vapor chamber upper surface which is adapted to direct a condensed working fluid toward a desired location on a vapor chamber lower surface. The vapor chamber lower surface may have at least one depression to collect a greater portion of the working fluid in a desired location(s).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.