Hard polishing pad for chemical mechanical planarization
US6551179B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 3, 2000 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Nov 3, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/047
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus for polishing an object comprises a pad having a polishing surface to be placed on a target surface of the object to be polished. A pad drive member is connected to the pad to move the pad relative to the object to change a position of the polishing surface of the pad on the target surface of the object. The pad comprises a backing material having a modulus of elasticity of at least about 300,000 psi. In specific embodiments, the pad includes grooves on the polishing surface. The pad has a thickness between about 0.05 and about 0.1 inch. The pad back material comprises a ceramic material. A compliant layer may be disposed between the pad and the pad drive member. The compliant layer comprises an elastomeric material. In some embodiments, a drive support is movably coupled with the pad drive member to support the pad drive member for rotation relative to the drive support around a pivot point which is disposed substantially on the target surface of the…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.