Method for removing organic contaminants from a semiconductor surface
US6551409B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 18, 1998 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Sep 18, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76814
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for removing organic contaminants from a semiconductor surface whereby the semiconductor is held in a tank and the tank is filled with a fluid such as a liquid or a gas. Organic contaminants, such as photoresist, photoresidue, and dry etched residue, occur in process steps of semiconductor fabrication and at times, require removal. The organic contaminants are removed from the semiconductor surface by holding the semiconductor inside a tank. The method is practiced using gas phase processing. The tank is filled with a gas mixture, comprising water vapor and ozone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.