Method of cleaning a semiconductor wafer with a cleaning brush assembly having a contractible and expandable arbor
US6551410B2 · kind B2 · utility
10Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2000 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Apr 3, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B1/34
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of cleaning a semiconductor wafer using a cleaning brush assembly having an arbor with: (1) an expandable member configured to have a non-expanded position and an expanded position, and (2) a cleaning brush, located about the expandable member, having an inner diameter greater than an outer diameter of the expandable member in the non-expanded position and less than an outer diameter of the expandable member in the expanded position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.