Method of producing a semiconductor device having two semiconductor chips sealed by a resin
US6551858B2 · kind B2 · utility
49Cited by
16References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 29, 2002 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Apr 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.