Methods and systems for measuring microroughness of a substrate combining particle counter and atomic force microscope measurements
US6552337B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2000 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Mar 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/852
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of the present invention provide methods for measuring a wafer surface. A portion of the wafer surface is measured using a particle counter to provide first measurements corresponding to a plurality of points on the wafer surface. A selected area of the wafer surface including one of the plurality of points is measured using an atomic force microscope (AFM) to provide a microroughness measurement of the selected area. The selected area is a localized area of the portion of the wafer surface measured using the particle counter. The first measurements and the microroughness measurement are provided as a measurement of the wafer surface. The portion measured using a particle counter may, for example, be substantially the entire wafer surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.