Electronic device and a method of manufacturing the same
US6553660B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Aug 23, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Aug 23, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic device including a first electronic component mounted on one main surface of a wiring board by being thermo-compression bonded by means of a thermo-compression bonding tool with an adhesive resin interposed between a first area of the one main surface of the wiring board and the first electronic component, and a second electronic component mounted on a second area different from the first area of the one main surface of the wiring board by melting a soldering paste material and higher than the first electronic component in post-mounting height, and wherein the first electronic component is mounted before the mounting of the second electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.