Semiconductor test structure having a laser defined current carrying structure
US6553661B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Jan 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49167
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test structure that is readily and inexpensively configurable to interface with dies having different bond pad configurations is achieved by providing a blank test membrane having a conductive coating or a matrix of conductive lines formed thereon. Once a die bond pad configuration is known, the test membrane can be configured for the die bond pads by using a laser under software control to define connection pads correlating to the die bond pads and also to define interconnecting conductive traces from the connecting pads to contact pads that can be connected to test equipment. In one embodiment, the laser operates to ablate a continuous conductive coating, so as to form conductive pads and traces. In another embodiment, the laser is used to cut various lines in a matrix of conductive lines, so as to define conductive paths from the bond pads to the contact pads for connection to the test equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.