Lester Wilson
11Patents
5h-index
8Co-inventors
48Inventor score
Filing activity: Oct 1, 1998 → Nov 8, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6906539B2 | High density, area array probe card apparatus | Emerging Cross-Sectional Technologies | 60 | Expired |
| US6720574B2 | Method of testing a semiconductor chip | Electricity | 11 | Expired |
| US6636063B2 | Probe card with contact apparatus and method of manufacture | Physics | 8 | Expired |
| US6376352B1 | Stud-cone bump for probe tips used in known good die carriers | Electricity | 8 | Expired |
| US6553661B2 | Semiconductor test structure having a laser defined current carrying structure | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7898275B1 | Known good die using existing process infrastructure | Electricity | 3 | Expired |
| US6209532A | Soft handling process tooling for low and medium volume known good die product | Electricity | 3 | Expired |
| US6489673B2 | Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers | Electricity | 2 | Expired |
| US6335226B1 | Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers | Electricity | 1 | Expired |
| US6720780B2 | High density probe card apparatus and method of manufacture | Physics | 0 | Expired |
| US7122895B2 | Stud-cone bump for probe tips used in known good die carriers | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.