Precise crystallographic-orientation alignment mark for a semiconductor wafer
US6554687B1 · kind B1 · utility
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6References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 27, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Sep 27, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24C1/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor wafer manufactured with a precise crystallographic-orientation alignment mark and a method of manufacturing. The method of manufacturing may include forcibly directing a carrier medium containing an abrasive material through a stencil to effect abrasive impact removal of a semiconductor surface in a defined machining area. The abrasive impact removal may be part of an automated machining process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.