Process for cleaning components using cleaning media
US6554909B1 · kind B1 · utility
5Cited by
7References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Nov 8, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for cleaning a semiconductor processing component is provided. The process calls for directing a stream of cleaning media at a surface of the component, the cleaning media including zirconia. After cleaning with the cleaning media, frozen CO2 (dry ice) pellets may be directed at the surface to further clean the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.