Method and device for protecting micro electromechanical system structures during dicing of a wafer
US6555417B2 · kind B2 · utility
73Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Dec 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.