Timothy Spooner
7Patents
4h-index
11Co-inventors
46Inventor score
Filing activity: Dec 5, 2001 → Jul 20, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6555417B2 | Method and device for protecting micro electromechanical system structures during dicing of a wafer | Electricity | 73 | Expired |
| US8344487B2 | Stress mitigation in packaged microchips | Electricity | 19 | Active |
| US7022546B2 | Method and device for protecting micro electromechanical systems structures during dicing of a wafer | Electricity | 13 | Expired |
| US6946326B2 | Method and device for protecting micro electromechanical systems structures during dicing of a wafer | Electricity | 6 | Expired |
| US6946366B2 | Method and device for protecting micro electromechanical systems structures during dicing of a wafer | Electricity | 4 | Expired |
| US6831772B2 | Optical mirror module | Physics | 0 | Expired |
| US7968807B2 | Package having a plurality of mounting orientations | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.