Method for production of a thin film and a thin-film solar cell, in particular, on a carrier substrate

US6555443B1 · kind B1 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Hans Artmann · Magstadt, DE
• Wilhelm Frey · Palo Alto, US
• Manfred Moellendorf · Los Altos, US

Key dates

• Filing date: Nov 10, 1999
• Grant date: Apr 29, 2003
• Expiry date: Nov 10, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/11

Abstract

A method for producing a thin film on a carrier substrate. For this purpose, a buried sacrificial layer is initially produced in the interior of a parent body, the buried sacrificial layer separating a layer from a residual body remaining from the parent body. After that, the carrier substrate is attached to the layer and the sacrificial layer is then removed. As a result, the thin film to be produced comes into being on the carrier substrate. The method is suitable for the production of electronic components or thin-film solar cells, the parent body being made up, for example, of monocrystalline silicon in which a sacrificial layer of porous silicon is produced.