Patent · US Expired

Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the like

US6555758B1 · kind B1 · utility

9Cited by

3References

6Claims

0Family size

Assignee

EPCOS AG · DE

Inventors

Alois Stelzl · Munich, DE
Hans Kruger · Birkenfeld, DE
Karl Weidner · Birkenfeld, DE
Manfred Wossler · Munich, DE

Key dates

Filing date	Nov 20, 2000
Grant date	Apr 29, 2003
Priority date	—
Expiry date	Nov 20, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1572
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The multiple blank can be diced into individual blanks for electronic components, in particular surface acoustic wave components. Each of the individual blanks is suitable for contact to be made with chips in the flip-chip technique and for contact to be made with the individual blanks in the SMD technique, using external connections. The multiple blank has, for each individual blank, metalized areas which are located on a network which is integrated between layers of the multiple blank and leads to a connecting terminal. Bumps are built up by depositing metal by electroplating on the metalized areas.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.