Multilayered circuit board for semiconductor chip module, and method of manufacturing the same
US6555763B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 15, 1999 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Sep 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09563
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayered circuit board for a semiconductor chip module includes an underlying board, insulating layers, fixed-potential wiring layers, via holes, and metal layers. The underlying board has a major surface made of a metal material to which a fixed potential is applied. The insulating layers are stacked on the major surface of the underlying board and have wiring layers formed on their surfaces. The fixed-potential wiring layers constitute part of the wiring layers formed on the insulating layers. The via holes are formed below the fixed-potential wiring layers to extend through the insulating layers. The metal layers are filled in the via holes so as to make upper ends be connected to the lower surfaces of the fixed-potential wiring layers. One of the insulating layers in contact with the major surface of the underlying board is formed on the underlying board while the lower end of the metal layer is in contact with the major surface of the underlying board. The other insulating layer formed on the insulating layer in contact with the major surface of the underlying board is stacked while the lower end of the metal layer is in contact with the upper surface of the fixed-potent…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.