Fuchigami Micro Co., Ltd.
4Patents
2Active
4Granted
35Portfolio score
Filing activity: Sep 15, 1999 → Mar 9, 2009 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8611089B2 | Heat pipe and circuit board with a heat pipe function | Emerging Cross-Sectional Technologies | 11 | Active |
| US6555763B1 | Multilayered circuit board for semiconductor chip module, and method of manufacturing the same | Electricity | 8 | Expired |
| US8982559B2 | Heat sink, cooling module and coolable electronic board | Electricity | 3 | Active |
| US6783921B2 | Method for etching laminated assembly including polyimide layer | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.