Measurement of critical dimensions using X-rays
US6556652B1 · kind B1 · utility
58Cited by
5References
40Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 9, 2000 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Nov 16, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N23/201
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for measurement of critical dimensions includes irradiating a surface of a substrate with a beam of X-rays. A pattern of the X-rays scattered from the surface due to features formed on the surface is detected and analyzed to measure a dimension of the features in a direction parallel to the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.