Apparatus and method for reclamation of used polishing slurry
US6558238B1 · kind B1 · utility
9Cited by
17References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2000 |
| Grant date | May 6, 2003 |
| Priority date | — |
| Expiry date | Oct 5, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a polishing slurry reclamation system. In one embodiment, the polishing slurry reclamation system comprises a polishing apparatus having a polishing platen and a fluid delivery system positioned to deliver a slurry or a rinse to the polishing platen, a recovery drain adjacent the polishing platen, and a fluid diverter associated with the platen and configured to deflect a selected one of a slurry or rinse emanating from the polishing platen to the recovery drain.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.