Scrubber operation

US6558471B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Brian J. Brown · Eastleigh, GB
• Yufei Chen · Gaozhou City, CN
• David G. Andeen · Los Gatos, US
• Madhavi R. Chandrachood · Sunnyvale, US

Key dates

• Filing date: Jan 26, 2001
• Grant date: May 6, 2003
• Expiry date: Jan 26, 2021

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B08B3/02
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

Methods and apparatuses are provided that remove a scrubber brush from contact with a wafer surface prior to slowing down the scrubber brush's rotational rate. The scrubbing method may include rotating a scrubber brush at a non-reduced rate, while the scrubber brush is in contact with the wafer and removing the scrubber brush from contact with the wafer while rotating the scrubber brush at the non-reduced rate. The scrubbing apparatus has a controller programmed to perform the scrubbing method.