Patent · US Expired

Semiconductor apparatus and method for manufacturing the same

US6558983B2 · kind B2 · utility

2Cited by
4References
3Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 16, 2001
Grant dateMay 6, 2003
Priority date
Expiry dateAug 16, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A semiconductor apparatus is provided which includes a lateral high-voltage semiconductor device which comprises a silicon substrate, a pair of main electrodes formed on the silicon substrate, and a silicon oxide film formed on the silicon substrate, such that at least a part of the silicon oxide film is located between the main electrodes. The semiconductor device further includes a voltage withstanding structure formed on the silicon oxide film, which structure includes a first silicon nitride film having a refractive index of not lower than 2.8, and a second silicon nitride film formed on the first silicon nitride film and having a refractive index of not higher than 2.2.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.