Pressure sensor with transducer mounted on a metal base
US6559379B2 · kind B2 · utility
24Cited by
24References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2001 |
| Grant date | May 6, 2003 |
| Priority date | — |
| Expiry date | Mar 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A three piece housing, designed to house semiconductor chips is molded using a polymer material. The chip sits on a metal base. Electrical leads pass through a molded housing to provide electrical contact between the semiconductor chip and external circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.