Stack of multilayer modules with heat-focusing metal layer
US6560109B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2001 |
| Grant date | May 6, 2003 |
| Priority date | — |
| Expiry date | Sep 7, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/167
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stack of multilayer modules has a segmentation layer disposed between neighboring multilayer modules. The segmentation layer facilitates the separation of neighboring multilayer modules. The stack of multilayer modules includes a first multilayer module and a second multilayer module. Each multilayer module includes a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The second multilayer module is disposed to be neighboring the first multilayer module with at least one segmentation layer between the first and second multilayer modules. The segmentation layer includes a metal layer and at least one thermoplastic adhesive layer. When heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.