Andrew Camien
8Patents
7h-index
5Co-inventors
48Inventor score
Filing activity: Dec 21, 1996 → Jun 10, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6117704A | Stackable layers containing encapsulated chips | Electricity | 87 | Expired |
| US5953588A | Stackable layers containing encapsulated IC chips | Electricity | 79 | Expired |
| US6072234A | Stack of equal layer neo-chips containing encapsulated IC chips of different sizes | Electricity | 67 | Expired |
| US7127807B2 | Process of manufacturing multilayer modules | Emerging Cross-Sectional Technologies | 54 | Expired |
| US6560109B2 | Stack of multilayer modules with heat-focusing metal layer | Electricity | 28 | Expired |
| US6717061B2 | Stacking of multilayer modules | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6734370B2 | Multilayer modules with flexible substrates | Emerging Cross-Sectional Technologies | 19 | Expired |
| US7786562B2 | Stackable semiconductor chip layer comprising prefabricated trench interconnect vias | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.