Corrosive resistant flip chip thermal management structure
US6560110B1 · kind B1 · utility
5Cited by
9References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2002 |
| Grant date | May 6, 2003 |
| Priority date | — |
| Expiry date | Feb 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20463
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A corrosive resistant electronics assembly 10 is provided including at least one heat generating electronics component 12 mounted on a substrate 14 and positioned within potting material 18. A thermally conductive block element 24 is thermally mounted to the at least one heat generating electronics component 12 and positioned within the potting material 18, thereby providing a corrosive resistant electronics assembly 10 with improved thermal dissipation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.