Apparatus and method for producing substrate with electrical wire thereon
US6561875B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2000 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Apr 26, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The apparatus and method for producing a substrate whose surface includes a metallic wire by polishing the substrate surface. A polishing liquid is supplied to a clearance between the substrate and the surface of a polishing pad. The polishing liquid includes an acid which dissolves the oxidized part of the substrate surface and is substantially free of solid abrasive powder. A relative movement is generated between the substrate surface and the polishing pad surface while the substrate surface is pressed against the polishing pad surface while the polishing liquid is supplied so that the dissolved oxidized part of the substrates surface can be removed from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.