Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating
US6562222B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Dec 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In filling fine via holes or trenches of the wiring (LSI) pattern formed on a semiconductor wafer, a copper electroplating is carried out by using a copper electroplating solution. containing an azole or a silane coupling agent, or a copper electroplating is carried out after the immersion into a pretreatment solution containing an azole or a silane coupling agent. As illustratively shown above, the addition of a component having the action to inhibit the dissolution of copper to an electroplating solution or the pretreatment by a solution containing a component having the action to inhibit the dissolution of copper can inhibit the dissolution of a copper seed layer covering poorly, and thus can prevent the occurrence of defects such as voids and seams.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.