Nikko-Materials Co., Ltd.
59Patents
10Active
59Granted
41Portfolio score
Filing activity: Nov 9, 1999 → Jul 29, 2021 · 4 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6528442B1 | Optical transparent film and sputtering target for forming optical transparent film | Physics | 38 | Expired |
| US6710181B2 | Imidazole/organic monocarboxylic acid salt derivative reaction product, method for producing the same, and surface treatment agent, resin additive and resin composition using the same | Chemistry; Metallurgy | 29 | Expired |
| US6759143B2 | Tantalum or tungsten target-copper alloy backing plate assembly and production method therefor | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6755948B1 | Titanium target for sputtering | Chemistry; Metallurgy | 23 | Expired |
| US6858116B2 | Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particles | Electricity | 23 | Expired |
| US6896788B2 | Method of producing a higher-purity metal | Chemistry; Metallurgy | 23 | Expired |
| US6638642B2 | Copper foil excellent in laser beam drilling performance and production method therefor | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6835241B2 | Surface treatment for copper foil | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6562222B1 | Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating | Electricity | 16 | Expired |
| US6793124B1 | Diffusion-joined target assemly of high-purity cobalt target and copper alloy backing plate and production method therefor | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6723183B2 | Silicide target for depositing less embrittling gate oxide and method of manufacturing silicide target | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6833198B2 | Copper clad laminate | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6582535B1 | Tungsten target for sputtering and method for preparing thereof | Performing Operations; Transporting | 13 | Expired |
| US6132487A | Mixed powder for powder metallurgy, sintered compact of powder metallurgy, and methods for the manufacturing thereof | Performing Operations; Transporting | 12 | Expired |
| US6960391B2 | Carrier-attached copper foil and printed board using the copper foil | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6780467B2 | Plating pretreatment agent and metal plating method using the same | Electricity | 11 | Expired |
| US6986834B2 | Hafnium silicide target and manufacturing method for preparation thereof | Electricity | 10 | Expired |
| US7651783B2 | Surface treated copper film | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7045461B2 | Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these | Chemistry; Metallurgy | 10 | Expired |
| US6497854B2 | Cathode material for a lithium secondary battery and method for manufacturing same | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6861030B2 | Method of manufacturing high purity zirconium and hafnium | Electricity | 9 | Expired |
| US6319621A | Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the same | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6875325B2 | Sputtering target producing few particles | Chemistry; Metallurgy | 7 | Expired |
| US6284111A | Sputtering target free of surface-deformed layers | Chemistry; Metallurgy | 7 | Expired |
| US6464847B1 | Sputtering target | Chemistry; Metallurgy | 7 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.