Silicon interposer and multi-chip-module (MCM) with through substrate vias
US6562653B1 · kind B1 · utility
240Cited by
10References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2000 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Sep 22, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package which includes an integrated circuit that is connected to a silicon substrate. The silicon substrate may have a via. The package may further include a solder bump that is attached to both the integrated circuit and the silicon subtstrate. The silicon substrate has a coefficient of thermal expansion that matches the coefficient of thermal expansion of the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.