Pedestal assembly with enhanced thermal conductivity
US6563686B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2001 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Mar 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pedestal assembly for supporting a substrate within a semiconductor process chamber is provided. In one embodiment, the pedestal assembly generally includes a ceramic body, a metallic housing and a cooling plate. The ceramic body is coupled to the housing and is adapted to support the substrate. The cooling plate is disposed against the ceramic body. A conformal graphite interstitial layer disposed between the cooling plate and the ceramic body to provide enhanced thermal conductivity therebetween over a thermal operating range of the pedestal assembly. In another embodiment, a pedestal assembly generally includes a removable ceramic body disposed on a cover. A conformal graphite interstitial layer disposed in a vacuum environment surrounding the pedestal assembly between the ceramic body and the cover. Optionally, a second conformal graphite interstitial layer disposed in an internal volume of the pedestal assembly between the cooling plate and the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.