Wire bonding method and wire bonding apparatus
US6564989B2 · kind B2 · utility
15Cited by
8References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 25, 2001 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | May 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20753
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding apparatus includes a bonding tool having a pressing surface for pressing a wire onto a surface to be joined to the wire and a wire feeding hole open to the pressing surface; a wire feeder for feeding the wire outside of the bonding tool through the wire feeding hole; and a magnet for applying an attraction force to a wire tip end protruding from the wire feeding hole, to bend and hold the wire tip end towards the pressing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.