Hideyuki Arakawa
13Patents
4h-index
21Co-inventors
60Inventor score
Filing activity: Apr 8, 1974 → May 10, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6774494B2 | Semiconductor device and manufacturing method thereof | Electricity | 116 | Expired |
| US7456091B2 | Semiconductor device and method of manufacturing the same | Electricity | 107 | Expired |
| US6564989B2 | Wire bonding method and wire bonding apparatus | Electricity | 15 | Expired |
| US7622799B2 | Semiconductor device, interposer chip and manufacturing method of semiconductor device | Electricity | 8 | Active |
| US5132330A | Method for manufacturing expandable styrene type polymer particles | Chemistry; Metallurgy | 4 | Expired |
| US4013608A | Method of producing polymer solutions of polymers or copolymers of vinyl chloride series | Chemistry; Metallurgy | 3 | Expired |
| US3956425A | Modifier for vinylidene chloride resin | Chemistry; Metallurgy | 1 | Expired |
| US8881966B2 | Method of manufacturing semiconductor device, and wire bonder | Emerging Cross-Sectional Technologies | 1 | Active |
| US7943433B2 | Method of manufacturing semiconductor device | Electricity | 0 | Active |
| US9230937B2 | Semiconductor device and a manufacturing method thereof | Electricity | 0 | Active |
| US8415245B2 | Method of manufacturing semiconductor device and semiconductor device | Electricity | 0 | Active |
| US7659635B2 | Semiconductor device and method of manufacturing the same | Electricity | 0 | Active |
| US7763966B2 | Resin molded semiconductor device and differential amplifier circuit | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.