Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatus
US6565422B1 · kind B1 · utility
14Cited by
9References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2000 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Feb 22, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In order to resolve problems of an increase in cost of transportation and vessels for polishing solutions to polish metal films, and of aging change of the polishing solutions, apparatus for preparing and mixing solutions of polishing materials without including abrasive are installed at a site the same as a site of polishing apparatus, an abrasive free slurry is supplied to the polishing apparatus and a metal film on a wiring substrate is polished to thereby form embedded metal wirings by which the cost of polishing metal can significantly be reduced and stability of the polishing solution is promoted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.