Hiroki Nezu
5Patents
5h-index
11Co-inventors
56Inventor score
Filing activity: Jul 6, 1993 → Feb 2, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5498768A | Process for forming multilayer wiring | Emerging Cross-Sectional Technologies | 49 | Expired |
| US6899603B2 | Polishing apparatus | Performing Operations; Transporting | 24 | Expired |
| US5670421A | Process for forming multilayer wiring | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6565422B1 | Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatus | Performing Operations; Transporting | 14 | Expired |
| US6719618B2 | Polishing apparatus | Performing Operations; Transporting | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.