Forming polymer features on a substrate
US6566280B1 · kind B1 · utility
197Cited by
22References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2002 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Aug 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Polymer features may be formed on a substrate by applying a polymer to a photoresist pattern which is subsequently removed to generate the desired polymer features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.