Electronic device package with high speed signal interconnect between die pad and external substrate pad
US6566761B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2002 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | May 3, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device package includes a modified ball grid array (“BGA”) interconnect substrate upon which a flip-chip device is mounted. The flip-chip device includes one or more high speed input/output solder bumps corresponding to input/output signals having data rates of up to 40 Gbps. A high speed solder bump is directly connected to an interconnect via formed within the BGA substrate, and the via is directly connected to a respective BGA solder ball positioned at an interior point of the BGA solder ball matrix. The BGA substrate is void of BGA solder balls between the designated high speed BGA solder ball and at least one edge of the substrate, thus providing a clear path to the designated high speed BGA solder ball for a high speed conductive trace formed on a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.