Method and apparatus for adhesion testing of thin film materials
US6567541B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2000 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Feb 25, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N19/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for the automatic testing the adhesion characteristics of thin film and coating to silicon wafers, and the processing of the data obtained thereby to present to the user a rapid and accurate forecast of the thin film's behavior in a selected processing environment. The apparatus of the invention heats and cools samples while automatically monitoring for debonding. Information collected from the optical and thermal devices are processed by computer for analysis and recorded for cataloging. Information is collected and processed over time while samples are subjected to selected temperature environments to provide a data base of adhesion characteristics of thin films and coatings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.