Phuc Van
14Patents
5h-index
6Co-inventors
51Inventor score
Filing activity: Feb 11, 2000 → Jan 12, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7019513B1 | Non-contact method and apparatus for measurement of sheet resistance and leakage current of p-n junctions | Physics | 16 | Expired |
| USD450000S | Multiple environment testing chamber | General | 11 | Expired |
| US6546820B1 | Method and apparatus for multifunction vacuum/nonvacuum annealing system | Physics | 9 | Expired |
| US7116429B1 | Determining thickness of slabs of materials by inventors | Physics | 7 | Expired |
| US6922067B1 | Determination of minority carrier diffusion length in solid state materials | Physics | 7 | Expired |
| US7502121B1 | Temperature insensitive low coherence based optical metrology for nondestructive characterization of physical characteristics of materials | Physics | 5 | Expired |
| US7362088B1 | Non contact method and apparatus for measurement of sheet resistance of P-N junctions | Physics | 5 | Expired |
| US6643393B1 | Method and apparatus for adhesion testing of thin film materials | Physics | 2 | Expired |
| US7804294B1 | Non contact method and apparatus for measurement of sheet resistance of P-N junctions | Physics | 2 | Active |
| US7741833B1 | Non contact method and apparatus for measurement of sheet resistance of p-n junctions | Physics | 2 | Active |
| US6567541B1 | Method and apparatus for adhesion testing of thin film materials | Physics | 2 | Expired |
| US7737680B1 | Non contact method and apparatus for measurement of sheet resistance of P-N junctions | Physics | 1 | Active |
| US6611616B1 | Method and apparatus for adhesion testing of thin film materials | Physics | 1 | Expired |
| US7737681B1 | Non contact method and apparatus for measurement of sheet resistance of P-N junctions | Physics | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.