Substrate carrier
US6569302B1 · kind B1 · utility
15Cited by
5References
41Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 22, 2001 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Jun 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68721
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a substrate carrier for holding substrates, especially semiconductor wafers. Good sealing of the wafer surface and electrical contact are made possible in that the substrate carrier has a first and a second part having a central opening matching the form of the substrate, wherein the substrate is received between the first and the second part and a peripheral seal having at least one undercut is provided in the inner periphery of the second part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.