Patent · US Expired

Process for molding an integral skin foam

US6569365B1 · kind B1 · utility

5Cited by
11References
3Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 24, 2000
Grant dateMay 27, 2003
Priority date
Expiry dateOct 7, 2020

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08G2110/0033
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A semi-rigid integral skin foam having a low foamed integral skin layer and a highly foamed core is molded from a polyurethane formulation injected into a mold cavity having a reduced pressure of 400 Torr or below. The formulation comprises a polyol component, an isocyanate component, and at least one substance selected from among formic acid, an amine salt thereof and an amine salt of boric acid, while not containing any freon.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.