Functional device and method of manufacturing the same
US6570223B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2001 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Oct 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/0227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A functional device and method of manufacturing the same are disclosed. A low-temperature softening layer and a heat-resistant layer are formed in this order on a substrate made of organic material such as polyethylene terephthalate, and a functional layer made of polysilicon is formed thereon. The functional layer is formed by crystallizing an amorphous silicon layer (precursor layer), with laser beam irradiation. When a laser beam is applied, heat causes the substrate to expand. However, stress caused by a difference in a thermal expansion coefficient between the substrate and the functional layer is absorbed by the low-temperature softening layer, so that no cracks and peeling occurs in the functional layer. The low-temperature softening layer is preferably made of a polymeric material containing acrylic resin. By properly interposing a metal layer and a heat-resistant layer between the substrate and the functional layer, a laser beam of higher intensity can be irradiated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.