Integrated circuit device having an embedded heat slug
US6570247B1 · kind B1 · utility
21Cited by
37References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1997 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Dec 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10158
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit device having an embedded heat slug. The integrated circuit device comprises, in one embodiment, a semiconductor substrate having a frontside surface and backside surface. The semiconductor substrate includes an integrated circuit on the frontside surface. A heat slug is disposed in an opening in the backside surface of the semiconductor substrate adjacent the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.