Method and apparatus for injection molded flip chip encapsulation
US6570261B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2002 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Apr 8, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chin assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.