Low thermal resistance interface for attachment of thermal materials to a processor die
US6570764B2 · kind B2 · utility
14Cited by
12References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1999 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Dec 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.