Method of and apparatus for chemical-mechanical polishing
US6572441B2 · kind B2 · utility
6Cited by
12References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Aug 25, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
During a CMP operation, vibration-caused variations in the forces holding a wafer against a polishing pad, and/or relatively moving the pad and the wafer are measured and the standard deviation thereof is used to minimize or eliminate the deleterious effects of the vibrations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.