Multizone slurry delivery for chemical mechanical polishing tool
US6572445B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 16, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Aug 4, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention includes a platen having a plurality of concentric fluid-tight plenums for receiving fluids. One or more fluid delivery systems may be used to control the flow rate and composition of fluids communicated to the plenums. The top surface of the platen may have holes for allowing the fluids, once inside the plenums, to travel to the top surface of a polishing pad. By controlling the flow rate and composition of fluids, the material removal rate on the front surface of the wafer may also be controlled. The polishing pad is preferably orbited during the planarization process. A metrology instrument may be used for measuring the front surface of the wafer. Data regarding the measurements may be used by a computer to determine if different flow rates and/or composition of fluids should be used to compensate for nonuniform polishing of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.