Method and apparatus for electrochemically depositing a material onto a workpiece surface
US6572755B2 · kind B2 · utility
13Cited by
21References
79Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Nov 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6723
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrochemical deposition apparatus and method for depositing a material onto a surface of a workpiece and for polishing the material are disclosed. The apparatus includes a platen and a polishing surface, including a conductive material and conductors embedded therein, disposed proximate the platen. During material deposition, a bias is applied across the conductor and the platen to cause deposition of material onto the workpiece surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.